HistoryUltrasonic technology can be found from the research on the piezoelectric effect conducted by Pierre Curie in 1880. Pierre Curie discovered that asymmetric crystals such as Rochelle salt and quartz can generate electric charge once mechanical pressure has been applied. Mechanical vibrations are thus obtained by applying electrical oscillations to the crystals. The frequency of the ultrasonic wave should be above 20,000 Hz. (Sound waves).After all the research on ultrasonic technology, the first ULTRA SONIC MACHINING (USM) was built in the 1950s. The United States develops ultrasonic machining and has been used for processing materials that need durable machines. Types There are two types of ultrasonic machining: -• Ultrasonic Machine (USM)• Rotary Ultrasonic Machine (RUM)Components and EquipmentUltrasonic has 5 different main components and equipmentAnd all this system depends on others: -A- Power supplyB- TransducerC- Tool HolderD- ToolsE- Abrasive SystemUSMThe ultrasonic processing system uses the system which mainly composes concentrator, magnetostrictor, slurry and tool. magnetostrictor creates small amplitude vibrations and revitalized at ultrasonic frequency Abrasive slurry: most types of abrasives • (SiC) silicon carbide, germanium, ceramic glass • diamond (for rubies) • (Al2O3) corundum • (B4C) Boron carbide is good in general, but also expensive• Silicate boron carbide (more abrasive than B4C)- Liquid• Oils• Glycerol• Benzene• Water (most used)- 100 to 800 is the typical grit size- High viscosity decreases MRR (material removal rate)Tool holderTool holder also connects and holds the tool to the transducer. It practically transmits energy and also in some situations amplifies the amplitude of the vibration. M......half of paper......60 HRC such as tungsten glass, carbides and ceramics (Rockwell hardness (HRB or HRC) is the measurement of the hardness of materials)Advantages1- Non-circular and circular drilling holes even in resistant material2- Its non-thermal nature is therefore less stressful3- It does not produce chemical, electrical or thermal effects on the surface4- Accurate processing of fragile and resistant materials5- Less disfigurement and less deburring process6- It can be applied in semiconductor materials 7- High quality surface finish 8- Can process any material regardless of its conductivity. Disadvantages1- Low MRR (material removal rate)2- The tool can wear quickly3- Difficult drilling of deep holes.4- Difficult to get into sharp corners.5- The bottom of the cavity is not flat.7- The consumption of energy is high.8- It can only be used when the hardness of the work is equal to or greater than 45 HRC.